EO Technics CO.,LTD (039030.KQ)
EO Technics makes laser marking and drilling equipment used in back-end processing, and it also sits in the display chain.
Company source: DART company overview — EO Technics CO.,LTD · Reviewed 2026-09-18
At the Oct 13 close, 1 rose and 2 fell, with a median move of −3.3%. Of the 3 stocks with a prior-session comparison, 2 improved relative strength and 1 improved momentum.
Compare 3 tracked South Korean companies in semiconductor back-end equipment: what they do, where they fit in the industry, and their local share prices.
Bonding, dicing, laser, and visual-inspection equipment for back-end processing
Prices are in South Korean won (KRW). Stock codes identify local KOSPI or KOSDAQ listings, not US ADRs. These are closing-price observations, not a real-time feed.
Highest composite score in this tracked group: EO Technics CO.,LTD. This is a multi-factor score, not relative strength alone.
| Company / listing | Close (KRW) | Change | Market cap (KRW) | Composite score |
|---|---|---|---|---|
| EO Technics CO.,LTDKOSDAQ · 039030 | 494,0002026-10-13 | -3.33% | 6.1T | 52.82026-10-13 |
| HANMI Semiconductor CO., LTD.KOSPI · 042700 | 229,0002026-10-13 | -7.85% | 21.8T | 52.12026-10-13 |
| INTEKPLUS CO., LTDKOSDAQ · 064290 | 61,7002026-10-13 | +7.87% | 802B | 46.12026-10-13 |
The 0–100 composite combines relative strength (30%), momentum (20%), volume (15%), ETF weight (15%), node correlation (5%), new inclusion (5%) and short-squeeze positioning (10%). It is not a return forecast or a pure relative-strength ranking. A dash means data is unavailable, not zero.
Business roles are separate from the site's screening rules. ETF inclusion or pension-fund ownership does not establish a company's product mix. Source-backed notes below explain our classification; they do not quantify revenue exposure or recommend a trade.
EO Technics makes laser marking and drilling equipment used in back-end processing, and it also sits in the display chain.
Company source: DART company overview — EO Technics CO.,LTD · Reviewed 2026-09-18
Hanmi Semiconductor supplies HBM thermocompression bonders and other back-end equipment. It is an equipment supplier to chip packaging, not a memory-chip manufacturer or an outsourced packaging service provider.
Company source: Hanmi Semiconductor — Product Lineup · Reviewed 2026-09-17
Intekplus makes appearance inspection equipment for semiconductor packages, vision systems that catch surface defects rather than testers measuring electrical performance.
Company source: DART company overview — INTEKPLUS CO., LTD · Reviewed 2026-09-18