At the Oct 13 close, none rose and 4 fell, with a median move of −1.8%. Of the 5 stocks with a prior-session comparison, 2 improved relative strength and 2 improved momentum.
Compare 5 tracked South Korean companies in semiconductor substrates: what they do, where they fit in the industry, and their local share prices.
FC-BGA, package substrates, lead frames, and chip interconnect substrates
Prices are in South Korean won (KRW). Stock codes identify local KOSPI or KOSDAQ listings, not US ADRs. These are closing-price observations, not a real-time feed.
Highest composite score in this tracked group: KOREA CIRCUIT CO.,LTD. This is a multi-factor score, not relative strength alone.
| Company / listing | Close (KRW) | Change | Market cap (KRW) | Composite score |
|---|---|---|---|---|
| KOREA CIRCUIT CO.,LTDKOSPI · 007810 | 80,3002026-10-13 | -0.25% | 1.9T | 61.42026-10-13 |
| DAEDUCK ELECTRONICS CO.,LTDKOSPI · 353200 | 146,9002026-10-13 | 0.00% | 7.3T | 59.82026-10-13 |
| SAMSUNG ELECTRO-MECHANICS CO.,LTDKOSPI · 009150 | 1,363,0002026-10-13 | -8.34% | 101.8T | 49.12026-10-13 |
| SIMMTECH Co., Ltd.KOSDAQ · 222800 | 150,5002026-10-13 | -2.84% | 5.8T | 46.52026-10-13 |
| HAESUNG DS Co.,Ltd.KOSPI · 195870 | 61,2002026-10-13 | -1.77% | 1T | 42.32026-10-13 |
The 0–100 composite combines relative strength (30%), momentum (20%), volume (15%), ETF weight (15%), node correlation (5%), new inclusion (5%) and short-squeeze positioning (10%). It is not a return forecast or a pure relative-strength ranking. A dash means data is unavailable, not zero.
Business roles are separate from the site's screening rules. ETF inclusion or pension-fund ownership does not establish a company's product mix. Source-backed notes below explain our classification; they do not quantify revenue exposure or recommend a trade.
Korea Circuit makes semiconductor package substrates and high-layer-count printed circuit boards, close to a substrate pure play within the Young Poong group.
Company source: DART company overview — KOREA CIRCUIT CO.,LTD · Reviewed 2026-09-18
Daeduck Electronics makes semiconductor package substrates and printed circuit boards, shifting weight towards higher-value FC-BGA products.
Company source: DART company overview — DAEDUCK ELECTRONICS CO.,LTD · Reviewed 2026-09-18
Samsung Electro-Mechanics supplies semiconductor package substrates such as FC-BGA. It makes the board that carries a chip and routes its signals, not the chip itself. Its MLCC and camera-module lines are large enough that it is not a substrate pure play.
Company source: SAMSUNG ELECTRO-MECHANICS CO.,LTD — Products · Reviewed 2026-09-18
Simmtech makes substrates for memory modules and system-in-package products, so shipments track the memory cycle directly.
Company source: DART company overview — SIMMTECH Co., Ltd. · Reviewed 2026-09-18
Haesung DS makes lead frames and package substrates, with automotive chip packaging a meaningful share, so the car cycle bears on results too.
Company source: DART company overview — HAESUNG DS Co.,Ltd. · Reviewed 2026-09-18